Home
Embedded Dielectrics For Electronic Packaging by Ching-ping Wong, Hardcover | Indigo Chapters
Loading Inventory...
Embedded Dielectrics For Electronic Packaging by Ching-ping Wong, Hardcover | Indigo Chapters
From Ching-ping Wong
Current price: $201.50
From Ching-ping Wong
Embedded Dielectrics For Electronic Packaging by Ching-ping Wong, Hardcover | Indigo Chapters
Current price: $201.50
Loading Inventory...
Size: 1 x 1 x 1
*Product information may vary - to confirm product availability, pricing, shipping and return information please contact Coles
This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing, etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance. | Embedded Dielectrics For Electronic Packaging by Ching-ping Wong, Hardcover | Indigo Chapters